The single-layer brazed diamond grinding wheel is a new type of super-hard abrasive grinding wheel. It uses brazing technology to realize the chemical and metallurgical combination of diamond abrasive grains, brazing bond and metal matrix interface, which fundamentally breaks the traditional grinding wheel bond. The physical package of the grains improves the holding strength of the abrasive grains of the brazed diamond grinding wheel. The climbing height of the solder bond is maintained at 20%~30% to achieve high-strength bonding of the abrasive grains, which is sufficient to meet the high-speed load of the grinding wheel. Or ultra-high-speed and efficient grinding process. The exposure degree of the abrasive grains of the diamond grinding wheel is as high as 70%~80%, which makes the grinding wheel sharper and greatly improves the cutting performance. The grinding force, grinding temperature, grinding power and grinding ratio generated during the grinding process are greatly reduced. Greatly improve the processing efficiency and the life of the brazing wheel. The chip holding space of the brazed grinding wheel is more sufficient and not easy to be blocked, which avoids the damage of the chips to the workpiece. At the same time, the chip holding space can accommodate more coolant, effectively reducing the temperature of the grinding workpiece and avoiding burns.
